- Previous Close
60.00 - Open
60.70 - Bid 61.00 x --
- Ask 61.10 x --
- Day's Range
60.60 - 61.70 - 52 Week Range
58.80 - 88.80 - Volume
244,649 - Avg. Volume
566,932 - Market Cap (intraday)
8.057B - Beta (5Y Monthly) --
- PE Ratio (TTM)
23.28 - EPS (TTM)
2.62 - Earnings Date --
- Forward Dividend & Yield 2.00 (3.33%)
- Ex-Dividend Date Jul 11, 2024
- 1y Target Est
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Shenmao Technology Inc., together with its subsidiaries, manufactures and sells solder materials in the Taiwan, Mainland China, Thailand, Malaysia, and internationally. The company offers SMT assembly materials comprising tin lead, lead-free, water soluble, package on package, low temperature, and halogen free solder pastes, as well as adhesives; and semiconductor packaging materials, such as BGA spheres and bumping solder pastes. It also provides wave solder assembly products, including solder bars, cored solder wires, lead free solder wires, and halogens free solder wires; liquid fluxes; solder preforms and ribbons; and PV ribbons. In addition, the company manufactures and trades solar photovoltaic products; and inspects semiconductor materials. It serves manufacturers of electronic computers, network communications, and consumer electronics. Shenmao Technology Inc. was founded in 1973 and is headquartered in Taoyuan City, Taiwan.
www.shenmao.com--
Full Time Employees
December 31
Fiscal Year Ends
Sector
Industry
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Statistics: 3305.TW
View MoreValuation Measures
Market Cap
7.93B
Enterprise Value
9.78B
Trailing P/E
22.90
Forward P/E
--
PEG Ratio (5yr expected)
--
Price/Sales (ttm)
1.15
Price/Book (mrq)
1.63
Enterprise Value/Revenue
1.33
Enterprise Value/EBITDA
14.23
Financial Highlights
Profitability and Income Statement
Profit Margin
4.97%
Return on Assets (ttm)
3.66%
Return on Equity (ttm)
7.55%
Revenue (ttm)
7.34B
Net Income Avi to Common (ttm)
364.62M
Diluted EPS (ttm)
2.62
Balance Sheet and Cash Flow
Total Cash (mrq)
1.77B
Total Debt/Equity (mrq)
74.07%
Levered Free Cash Flow (ttm)
-754.85M